| Pages:
1
2 |
jpsmith123
National Hazard
Posts: 764
Registered: 24-6-2005
Member Is Offline
Mood: No Mood
|
|
Rosco do you know if TiH2 can be soldered? I thought I remembered reading somewhere that it could be, but I may be mistaken.
|
|
|
Rosco Bodine
Banned
Posts: 6370
Registered: 29-9-2004
Member Is Offline
Mood: analytical
|
|
The only thing I have seen related to that is the hydride
being used as part of a powdered brazing alloy for joining
Ti to ceramic , but the heat is sufficient to decompose the hydride there . I think that is an inert atmosphere process , too .
It would seem possible that TiH2 could be soldered through if there was something there that would flux it away exposing the Ti . I have a feeling it
would have to be done in an inert atmosphere though . For example , under argon or something similar , molten anhydrous chlorides of lower activity
metals might
" tin " the Ti with the reduced elemental metal parent of that chloride . It could form a " filled plating " fusion coating of the metal flowed like
solder if it was hot enough . But I don't know for sure about this .
|
|
|
Rosco Bodine
Banned
Posts: 6370
Registered: 29-9-2004
Member Is Offline
Mood: analytical
|
|
AC/DC ? hold the phone !
| Quote: | Originally posted by Xenoid
| Quote: | Originally posted by jpsmith123
(BTW, in re-reading Beer's patents, he does give some examples of MMO coatings electrodeposited onto Ti substrates, but he uses AC rather than DC.
Maybe the AC is what keeps the surface from passivating).
|
How can AC deposit anything? Surely the net effect is zero! Depositing on one cycle and removing on the next... ad infinitum! Can someone please
elaborate.
Regards, Xenoid |
Which of the Beer patents related to the use of AC ?
This is something that has been sneaking around lurking in the back of my mind since posting it six months ago .
Even though the patent applies to aluminum , if Beer was
using a similar process with Ti , that would make good sense .
http://www.sciencemadness.org/talk/viewthread.php?tid=2465&a...
Attachment: US6228241 Electrically_conductive_porous_anodized_aluminu.pdf (86.56 KiB)
http://www.sciencemadness.org/talk/viewthread.php?action=att...
The patent relates to aluminum . But the method may also be applicable to Titanium . Interesting that both Tin , and
Cobalt are two metals which may be electrodeposited directly
onto the bottoms of the columnar wells which are the pores
covering the oxide layer . This could have usefulness for
production of conductive and adherent anode coatings ,
perhaps having better performance than those where
materials are simply painted on the surface and baked ,
on Ti .
This process would "get down deep" into the pores depositing a metal whose volume would then increase upon oxidation , to anchor itself firmly into
the oxide .
The post just above the one linked could have usefulness
also with regards to titanium .
|
|
|
Rosco Bodine
Banned
Posts: 6370
Registered: 29-9-2004
Member Is Offline
Mood: analytical
|
|
TiH2 substrate for baked Co spinel
Back on topic
I think jpsmith123 found this patent which involves
both the baked cobalt spinel and the TiH2 substrate .
While a sintered Ti substrate is hydrided in the example 1
described in the patent , the patent also states that a
solid Ti substrate can be hydrided and then used as a substrate for the baked cobalt spinel . The hydride layer
is said to be needed at 0.5 micron thickness , which would
be about a five to ten minute hydriding applied by electrolytic means to a Ti substrate .
US4222842
Attachment: US4222842 Cobalt Spinel on Hydrided Titanium Substrate.pdf (141kB)
This file has been downloaded 512 times
|
|
|
Texium
|
Thread Moved
19-11-2023 at 12:13 |
| Pages:
1
2 |
![[*]](images/xpblue/default_icon.gif){kind=icon}
