maximum temperature would be dependant upon how the wind blows
in still air an approximation (sorry, memory only, no reference) is
dT = (mW/cm2)^0.833
dT = increase in Celcius above ambient
mW = milli-Watts dissipated
cm2 = surface area available for convection cooling
this approximation is used for electronic devices etc. up to about 125C
I have no idea what the errors would be at say 400C
or in the case of the solder pot with restricted airflow
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