.... An interesting fact is that by adding a chloride to the acetic acid/H2O2 mix, is that the dissolving/etching of the Copper metal appears to be
visibly accelerated. My take on some of the chemistry in our case (see http://www.hkedcity.net/article/project/hkcho/1P.pdf ):
2 Cu(s) + 2 H2O2 + 4 H+ --> 2 [Cu 2+] (aq) + 4 H2O
[Cu 2+] (aq) + Cu (s) <--> 2 [Cu +] (aq)
[Cu +] (ag) + 2 Cl- (aq) --> [CuCl2 -] (aq)
2 [CuCl2 -] (aq) + H2O2 (aq) + [H +] (aq) + 4 Cl- (aq) < --> 2 [CuCl4 2-] (aq) + OH- (aq) + H2O
[CuCl4 2-] (aq) + Cu(s) <--> 2 [CuCl2-] (aq)
where the 3rd equation requires a high chloride concentration and the last equation causes a circling back to the 4th equation. Upon evaporation, the
addition of say NaCl to accelerate the reaction, may cause at least a more costly salt separation issue to isolate the pure Copper acetate (as
Cu(OAc)2 is soluble in alcohol whereas NaCl is not).
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