First, are you sure the case you picked will stand the negative pressure? Firgure out how much force will be on it under vacuum.
This case is nothing more than a miniature clean-room, in which the components will operate. The coolant-loop is completely closed. If there
were any leaks into the cavity of the case, the process would stop. And, if the vacuum system isn't strong enough to boil water, how would it have
enough power to impact the structure of the case?
Second, yes you can stack Venturis in series with the 'downstream' one being larger than the upstream one as it has to handle the full flow of the
upstream.
I almost didn't understand you here. But now I realize by upstream, you mean the pump. And by downstream, you mean the outlet of the injector.
This is precisely how the design is configured
Before going any further, you should analyse the requirements. Don't think about the liquid you will use, you will calculate what it's properties need
to be.
How much heat is being generate, and what is the target temperature. How do you plan to dump the heat; remember that pumps will add heat to the
system, and dry heat exchanges can not cool below ambient temperature.
This system will have a maximum cpu count of 12 in the present configuration. Given 75 Watts per processor, the load will greater than 900
Watts when the cooling system is included. The cooling system will produce some heat. Though I'm not sure yet how much. I intend to simply provide the
largest cooling system to handle any possible load.
So you end up with a heat source of X watts that you want to keep at temperature Y while rejecting that heat into a sink of temperature Y. This lets
you calculate the thermal impedance, and the size of the heat sink if you are rejecting heat into the ambient air - heat sink vendors should show you
how to calculate that.
Venturis using liquids will give you no lower vacuum than the vapour pressure of the liquid at its working temperature.
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