Simultaneous application of colloidal processing and liquid-forming additives to alumina resulted in a sintered density of >99% in 1 h at a
temperature as low as 1070°C for a commercial high-purity alumina powder at a total dopant level of 2 mol%. The additives were 0.9% CuO + 0.9% TiO2 +
0.1% B2O3 + 0.1% MgO. At higher temperatures or after prolonged sintering, the doped alumina ceramic developed a duplex microstructure containing
large elongated grains and exhibited a relatively high fracture toughness of ~3.8 MPa · m1/2 as compared to a value of ~2.6 MPa · m1/2 for the
undoped alumina. |