http://jes.ecsdl.org/content/84/1/319.abstract
Are you able to access the article?
Also, I would use pulse-reverse plating. I use this method routinely for electrodepositing copper and nickel. It allows for control over grain
structure and provides better leveling.
No matter what method you use, the plating solution must be filtered very well, no dust or foreign particles allowed. Ideally it is constantly
filtered, but for small jobs it is sufficient to filter before use. This minimizes the risk of nodules.
Of course, the chemicals used must be very pure, else the results are unpredictable.
|