The problem is the adhesive that is used to bond the polyimide layer to the copper layer. As far as I can tell this is usually a nitrile modified
phenolic resin. All I've been able to find so far is that phenolic resin seems to resist pretty much everything, but is not recommended for use with
caustic solutions.
The NaOH solution does slowly damage the adhesive over a couple of hours, but I was wondering if anyone has a suggestion for something that might work
a bit faster, but wont affect the copper layers. And preferably doesn't require a hazmat suit.
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